Anisotropic thermal expansion of Ni 3 Sn 4 , Ag 3 Sn, Cu 3 Sn, Cu 6 Sn 5 and βSn
نویسندگان
چکیده
منابع مشابه
Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects
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ژورنال
عنوان ژورنال: Intermetallics
سال: 2017
ISSN: 0966-9795
DOI: 10.1016/j.intermet.2017.08.002